Examples of countermeasures in the semiconductor and LCD industry
Preventing static electricity during wafer testing
- Electrostatic destruction
Reliable static elimination is possible in wafer testing environments by installing a feedback sensor near the target to enable constant monitoring of the target area.
Eliminating static when peeling protective film from wafers
- Electrostatic destruction
- Adhesion of foreign particles
Static electricity can be eliminated quickly over a wide area. Recording static elimination results during peeling makes it possible to identify the cause of problems.
Static electricity prevention during die bonding
- Electrostatic destruction
Using high-speed static elimination to prevent discharges during die releasing helps reduce maintenance that would otherwise be necessary with conventional devices.
Test handler ESD protection and quality assurance
- Electrostatic destruction
With a high-performance ion balance of ±1 V, the device can be used safely in any semiconductor manufacturing site. Previous static elimination results can also be checked to identify affected periods in the event of a problem.
Static elimination during fork transferring of liquid crystal glass
- Adhesion of foreign particles
Airless and energy-saving ionizers help reduce air consumption in a factory while ensuring advanced static elimination performance.
Static elimination during air showers
- Adhesion of foreign particles
Installing ionizers in air shower rooms—where the risk of introducing foreign particles into a clean room is highest—helps improve dust removal effectiveness.
For more information, please contact KEYENCE.