Marking on IC package

Marking on IC package

Marking on IC packages

Crating high contrasting marks on IC packages becomes more difficult as the thickness of IC packages becomes thinner and thinner. High contrast marks without engraving is necessary to eliminate damage and the MDV series laser provides a clear advantage.


High contrast marking without engraving. And a 300mm wide area helps reducing the need for product indexing and X-Y stages.

3-Axis Fibre Laser Marker